| |
| 2006 | ||
|---|---|---|
| 1 | EE | Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: Effect of wafer thinning methods towards fracture strength and topography of silicon die. Microelectronics Reliability 46(5-6): 836-845 (2006) |
| 1 | Ibrahim Ahmad | [1] |
| 2 | Azman Jalar | [1] |
| 3 | Ghazali Omar | [1] |