| 2007 |
|---|
| 3 | EE | Hendrik F. Hamann,
Alan J. Weger,
James A. Lacey,
Zhigang Hu,
Pradip Bose,
Erwin Cohen,
Jamil A. Wakil:
Temperature-limited microprocessors: Measurements and design implications.
VLSI Design 2007: 427-432 |
| 2006 |
|---|
| 2 | EE | Jamil A. Wakil:
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks.
Microelectronics Reliability 46(2-4): 380-385 (2006) |
| 2005 |
|---|
| 1 | EE | Edmund D. Blackshear,
Moises Cases,
Erich Klink,
Stephen R. Engle,
Ronald S. Malfatt,
Daniel N. deAraujo,
Stefano Oggioni,
Luke D. Lacroix,
Jamil A. Wakil,
Nam H. Pham,
Gareth G. Hougham,
David J. Russell:
The evolution of build-up package technology and its design challenges.
IBM Journal of Research and Development 49(4-5): 641-662 (2005) |
