dblp.uni-trier.dewww.uni-trier.de

Chin-Li Kao

List of publications from the DBLP Bibliography Server - FAQ
Coauthor Index - Ask others: ACM DL/Guide - CiteSeer - CSB - Google - MSN - Yahoo

2006
3EEYi-Shao Lai, Chin-Li Kao: Characteristics of current crowding in flip-chip solder bumps. Microelectronics Reliability 46(5-6): 915-922 (2006)
2EEChang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao: Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectronics Reliability 46(7): 1172-1182 (2006)
1EEYi-Shao Lai, Chin-Li Kao: Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectronics Reliability 46(8): 1357-1368 (2006)

Coauthor Index

1Yi-Shao Lai [1] [2] [3]
2Chang-Lin Yeh [2]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)