| |
| 2006 | ||
|---|---|---|
| 3 | EE | Yi-Shao Lai, Chin-Li Kao: Characteristics of current crowding in flip-chip solder bumps. Microelectronics Reliability 46(5-6): 915-922 (2006) |
| 2 | EE | Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao: Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectronics Reliability 46(7): 1172-1182 (2006) |
| 1 | EE | Yi-Shao Lai, Chin-Li Kao: Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages. Microelectronics Reliability 46(8): 1357-1368 (2006) |
| 1 | Yi-Shao Lai | [1] [2] [3] |
| 2 | Chang-Lin Yeh | [2] |