![]() | ![]() |
2006 | ||
---|---|---|
1 | EE | Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low: Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectronics Reliability 46(7): 1160-1171 (2006) |
1 | F. X. Che | [1] |
2 | Desmond Y. R. Chong | [1] |
3 | Kellin Ng | [1] |
4 | John H. L. Pang | [1] |
5 | Jane Y. N. Tan | [1] |