Dae Whan Kim

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2006

1 EE Dae Whan Kim, Byung-Seon Kong: The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump. Microelectronics Reliability 46(7): 1087-1094 (2006)

2006
1	EE	Dae Whan Kim, Byung-Seon Kong: The effect of hygro-mechanical and thermo-mechanical stress on delamination of gold bump. Microelectronics Reliability 46(7): 1087-1094 (2006)

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