| 2006 |
|---|
| 3 | EE | K. M. Chen,
D. S. Jiang,
N. H. Kao,
J. Y. Lai:
Effects of underfill materials on the reliability of low-K flip-chip packaging.
Microelectronics Reliability 46(1): 155-163 (2006) |
| 2 | EE | K. M. Chen,
B. C. Wu,
K. H. Tang,
F. Y. Cheng,
N. H. Kao,
J. Y. Lai:
An investigation into the effects of probing and wire bonding stress on the reliability of BOAC.
Microelectronics Reliability 46(2-4): 335-342 (2006) |
| 2005 |
|---|
| 1 | EE | J. Y. Lai,
Arcot Sowmya,
John Trinder:
Support Vector Machine Experiments for Road Recognition in High Resolution Images.
MLDM 2005: 426-436 |
