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Yanmin Liu

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2006
1EEXu Chen, Jun Zhang, Chunlei Jiao, Yanmin Liu: Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection. Microelectronics Reliability 46(5-6): 774-785 (2006)

Coauthor Index

1Xu Chen [1]
2Chunlei Jiao [1]
3Jun Zhang [1]

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