| 2007 |
|---|
| 4 | EE | M. A. J. van Gils,
O. van der Sluis,
G. Q. Zhang,
J. H. J. Janssen,
R. M. J. Voncken:
Analysis of Cu/low-k bond pad delamination by using a novel failure index.
Microelectronics Reliability 47(2-3): 179-186 (2007) |
| 2006 |
|---|
| 3 | EE | R. L. J. M. Ubachs,
O. van der Sluis,
W. D. van Driel,
G. Q. Zhang:
Multiscale modelling of multilayer substrates.
Microelectronics Reliability 46(9-11): 1472-1477 (2006) |
| 2 | EE | C. Yuan,
W. D. van Driel,
R. B. R. van Silfhout,
O. van der Sluis,
R. A. B. Engelen,
L. J. Ernst,
F. van Keulen,
G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Microelectronics Reliability 46(9-11): 1679-1684 (2006) |
| 1 | EE | W. D. van Driel,
O. van der Sluis,
D. G. Yang,
R. L. J. M. Ubachs,
C. Zenz,
G. Aflenzer,
G. Q. Zhang:
Reliability modelling for packages in flexible end-products.
Microelectronics Reliability 46(9-11): 1880-1885 (2006) |
