F. Wulff

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2006

3 EE C. D. Breach, F. Wulff: Oxidation of Au₄Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175degreeC. Microelectronics Reliability 46(12): 2112-2121 (2006)

2 EE C. D. Breach, F. Wulff, C. W. Tok: An unusual mechanical failure mode in gold ballbonds at 50mum pitch due to degradation at the Au-Au₄Al interface during ageing in air at 175degreeC. Microelectronics Reliability 46(2-4): 543-557 (2006)

2004

1 EE C. D. Breach, F. Wulff: New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au₄Al. Microelectronics Reliability 44(6): 973-981 (2004)

2006
3	EE	C. D. Breach, F. Wulff: Oxidation of Au₄Al in un-moulded gold ballbonds after high temperature storage (HTS) in air at 175degreeC. Microelectronics Reliability 46(12): 2112-2121 (2006)
2	EE	C. D. Breach, F. Wulff, C. W. Tok: An unusual mechanical failure mode in gold ballbonds at 50mum pitch due to degradation at the Au-Au₄Al interface during ageing in air at 175degreeC. Microelectronics Reliability 46(2-4): 543-557 (2006)
2004
1	EE	C. D. Breach, F. Wulff: New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au₄Al. Microelectronics Reliability 44(6): 973-981 (2004)

Coauthor Index

1 C. D. Breach [1] [2] [3]

2 C. W. Tok [2]