| |
| 2007 | ||
|---|---|---|
| 4 | EE | Z. Khatir, S. Lefebvre, F. Saint-Eve: Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices. Microelectronics Reliability 47(2-3): 422-428 (2007) |
| 2006 | ||
| 3 | EE | L. Dupont, Z. Khatir, S. Lefebvre, S. Bontemps: Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectronics Reliability 46(9-11): 1766-1771 (2006) |
| 2004 | ||
| 2 | EE | Z. Khatir, S. Lefebvre: Boundary element analysis of thermal fatigue effects on high power IGBT modules. Microelectronics Reliability 44(6): 929-938 (2004) |
| 2003 | ||
| 1 | EE | S. Carubelli, Z. Khatir: Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions. Microelectronics Journal 34(12): 1143-1151 (2003) |
| 1 | S. Bontemps | [3] |
| 2 | S. Carubelli | [1] |
| 3 | L. Dupont | [3] |
| 4 | S. Lefebvre | [2] [3] [4] |
| 5 | F. Saint-Eve | [4] |