| |
| 2006 | ||
|---|---|---|
| 1 | EE | Oliver Aubel, Eberhard Bugiel, Dietmar Krüger, Wolfgang Hasse, Martina Hommel: Investigation of the influence of thermal treatment on interconnect-barrier interfaces in copper metallization systems. Microelectronics Reliability 46(5-6): 768-773 (2006) |
| 1 | Oliver Aubel | [1] |
| 2 | Wolfgang Hasse | [1] |
| 3 | Martina Hommel | [1] |
| 4 | Dietmar Krüger | [1] |