2006 | ||
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3 | EE | Y. L. Zhang, G. J. Wang, Z. C. Ji: Replacement problems for a cold standby repairable system. Int. J. Systems Science 37(1): 17-25 (2006) |
2 | EE | Y. L. Zhang, D. X. Q. Shi, W. Zhou: Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading. Microelectronics Reliability 46(2-4): 409-420 (2006) |
2005 | ||
1 | EE | G. J. Wang, Y. L. Zhang: A shock model with two-type failures and optimal replacement policy. Int. J. Systems Science 36(4): 209-214 (2005) |
1 | Z. C. Ji | [3] |
2 | D. X. Q. Shi | [2] |
3 | G. J. Wang | [1] [3] |
4 | W. Zhou | [2] |