| 2008 |
|---|
| 11 | EE | Guangyu Huang,
Cher Ming Tan:
Reverse Breakdown Voltage Measurement for Power P+NN+ Rectifier.
J. Electronic Testing 24(5): 473-479 (2008) |
| 2006 |
|---|
| 10 | EE | Cher Ming Tan,
Zhenghao Gan,
Tai Chong Chai:
Feasibility study of the application of voltage contrast to printed circuit board.
Microelectronics Reliability 46(5-6): 939-948 (2006) |
| 9 | EE | Cher Ming Tan,
Wei Li,
Kok Tong Tan,
Frankie Low:
Development of highly accelerated electromigration test.
Microelectronics Reliability 46(9-11): 1638-1642 (2006) |
| 8 | EE | Arijit Roy,
Cher Ming Tan:
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect.
Microelectronics Reliability 46(9-11): 1652-1656 (2006) |
| 7 | EE | Guang Yu Huang,
Cher Ming Tan:
Device level electrical-thermal-stress coupled-field modeling.
Microelectronics Reliability 46(9-11): 1823-1827 (2006) |
| 2005 |
|---|
| 6 | EE | Cher Ming Tan,
Zhenghao Gan,
Wai Fung Ho,
Sam Chen,
Robert Liu:
Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications.
Microelectronics Reliability 45(1): 179-184 (2005) |
| 5 | EE | Arijit Roy,
Cher Ming Tan,
Rakesh Kumar,
Xian Tong Chen:
Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures.
Microelectronics Reliability 45(9-11): 1443-1448 (2005) |
| 4 | EE | Cher Ming Tan,
Arijit Roy,
Kok Tong Tan,
Derek Sim Kwang Ye,
Frankie Low:
Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects.
Microelectronics Reliability 45(9-11): 1449-1454 (2005) |
| 3 | EE | Cher Ming Tan,
Kim Peng Lim,
Tai Chong Chai,
Guat Cheng Lim:
Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist.
Microelectronics Reliability 45(9-11): 1572-1575 (2005) |
| 2 | EE | Cher Ming Tan,
Joe Chiu,
Robert Liu,
Guan Zhang:
Reliability screening through electrical testing for press-fit alternator power diode in automotive application.
Microelectronics Reliability 45(9-11): 1723-1727 (2005) |
| 2001 |
|---|
| 1 | EE | Cher Ming Tan,
Kelvin Ngan Chong Yeo:
A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT).
J. Electronic Testing 17(1): 63-68 (2001) |
