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Cher Ming Tan

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2008
11EEGuangyu Huang, Cher Ming Tan: Reverse Breakdown Voltage Measurement for Power P+NN+ Rectifier. J. Electronic Testing 24(5): 473-479 (2008)
2006
10EECher Ming Tan, Zhenghao Gan, Tai Chong Chai: Feasibility study of the application of voltage contrast to printed circuit board. Microelectronics Reliability 46(5-6): 939-948 (2006)
9EECher Ming Tan, Wei Li, Kok Tong Tan, Frankie Low: Development of highly accelerated electromigration test. Microelectronics Reliability 46(9-11): 1638-1642 (2006)
8EEArijit Roy, Cher Ming Tan: Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect. Microelectronics Reliability 46(9-11): 1652-1656 (2006)
7EEGuang Yu Huang, Cher Ming Tan: Device level electrical-thermal-stress coupled-field modeling. Microelectronics Reliability 46(9-11): 1823-1827 (2006)
2005
6EECher Ming Tan, Zhenghao Gan, Wai Fung Ho, Sam Chen, Robert Liu: Determination of the dice forward I-V characteristics of a power diode from a packaged device and its applications. Microelectronics Reliability 45(1): 179-184 (2005)
5EEArijit Roy, Cher Ming Tan, Rakesh Kumar, Xian Tong Chen: Effect of test condition and stress free temperature on the electromigration failure of Cu dual damascene submicron interconnect line-via test structures. Microelectronics Reliability 45(9-11): 1443-1448 (2005)
4EECher Ming Tan, Arijit Roy, Kok Tong Tan, Derek Sim Kwang Ye, Frankie Low: Effect of vacuum break after the barrier layer deposition on the electromigration performance of aluminum based line interconnects. Microelectronics Reliability 45(9-11): 1449-1454 (2005)
3EECher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim: Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist. Microelectronics Reliability 45(9-11): 1572-1575 (2005)
2EECher Ming Tan, Joe Chiu, Robert Liu, Guan Zhang: Reliability screening through electrical testing for press-fit alternator power diode in automotive application. Microelectronics Reliability 45(9-11): 1723-1727 (2005)
2001
1EECher Ming Tan, Kelvin Ngan Chong Yeo: A Reliability Statistics Perspective on the Pitfalls of Standard Wafer-Level Electromigration Accelerated Test (SWEAT). J. Electronic Testing 17(1): 63-68 (2001)

Coauthor Index

1Tai Chong Chai [3] [10]
2Sam Chen [6]
3Xian Tong Chen [5]
4Joe Chiu [2]
5Zhenghao Gan [6] [10]
6Wai Fung Ho [6]
7Guang Yu Huang [7]
8Guangyu Huang [11]
9Rakesh Kumar [5]
10Wei Li [9]
11Guat Cheng Lim [3]
12Kim Peng Lim [3]
13Robert Liu [2] [6]
14Frankie Low [4] [9]
15Arijit Roy [4] [5] [8]
16Kok Tong Tan [4] [9]
17Derek Sim Kwang Ye [4]
18Kelvin Ngan Chong Yeo [1]
19Guan Zhang [2]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)