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Melody A. Verges

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2006
2EEMichael C. Larson, Melody A. Verges, Xia Liu: Residual compression in area array packages induced by underfill shrinkage. Microelectronics Reliability 46(2-4): 496-502 (2006)
1EEXia Liu, Valmiki K. Sooklal, Melody A. Verges, Michael C. Larson: Experimental study and life prediction on high cycle vibration fatigue in BGA packages. Microelectronics Reliability 46(7): 1128-1138 (2006)

Coauthor Index

1Michael C. Larson [1] [2]
2Xia Liu [1] [2]
3Valmiki K. Sooklal [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)