| |
| 2006 | ||
|---|---|---|
| 1 | EE | Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh: Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectronics Reliability 46(2-4): 645-650 (2006) |
| 1 | Yi-Shao Lai | [1] |
| 2 | Chang-Lin Yeh | [1] |