YoungBae Kim
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2006
1
EE
YoungBae Kim,
Hiroshi Noguchi
,
Masazumi Amagai
: Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder.
Microelectronics Reliability 46
(2-4): 459-466 (2006)
Coauthor
Index
1
Masazumi Amagai
[
1
]
2
Hiroshi Noguchi
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
