| |
| 2006 | ||
|---|---|---|
| 1 | EE | Takayoshi Katahira, Ilkka Kartio, Hiroshi Segawa, Michimasa Takahashi, Katsumi Sagisaka: Vertically high-density interconnection for mobile application. Microelectronics Reliability 46(5-6): 756-762 (2006) |
| 1 | Ilkka Kartio | [1] |
| 2 | Takayoshi Katahira | [1] |
| 3 | Katsumi Sagisaka | [1] |
| 4 | Hiroshi Segawa | [1] |