| |
| 2006 | ||
|---|---|---|
| 1 | EE | Desmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low: Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectronics Reliability 46(7): 1160-1171 (2006) |
| 1 | F. X. Che | [1] |
| 2 | Desmond Y. R. Chong | [1] |
| 3 | Patrick T. H. Low | [1] |
| 4 | Kellin Ng | [1] |
| 5 | John H. L. Pang | [1] |