M. Ullán

2006
2	EE	M. Ullán, M. Lozano, M. Chmeissani, G. Blanchot, Enric Cabruja, J. García, M. Maiorino, R. Martínez, G. Pellegrini, C. Puigdengoles: Test structure assembly for bump bond yield measurement on high density flip chip technologies. Microelectronics Reliability 46(7): 1095-1100 (2006)
2002
1	EE	J. M. Rafí, B. Vergnet, F. Campabadal, C. Fleta, L. Fonseca, M. Lozano, C. Martínez, M. Ullán: Electrical characteristics of high-energy proton irradiated ultra-thin gate oxides. Microelectronics Reliability 42(9-11): 1501-1504 (2002)

Coauthor Index

1	G. Blanchot	[2]
2	Enric Cabruja	[2]
3	F. Campabadal	[1]
4	M. Chmeissani	[2]
5	C. Fleta	[1]
6	L. Fonseca	[1]
7	J. García	[2]
8	M. Lozano	[1] [2]
9	M. Maiorino	[2]
10	C. Martínez	[1]
11	R. Martínez	[2]
12	G. Pellegrini	[2]
13	C. Puigdengoles	[2]
14	J. M. Rafí	[1]
15	B. Vergnet	[1]