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S. Bontemps

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2006
1EEL. Dupont, Z. Khatir, S. Lefebvre, S. Bontemps: Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectronics Reliability 46(9-11): 1766-1771 (2006)

Coauthor Index

1L. Dupont [1]
2Z. Khatir [1]
3S. Lefebvre [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)