| |
| 2006 | ||
|---|---|---|
| 1 | EE | L. Dupont, Z. Khatir, S. Lefebvre, S. Bontemps: Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectronics Reliability 46(9-11): 1766-1771 (2006) |
| 1 | L. Dupont | [1] |
| 2 | Z. Khatir | [1] |
| 3 | S. Lefebvre | [1] |