|  |  | 
| 2006 | ||
|---|---|---|
| 2 | EE | E. Misra, N. D. Theodore, J. W. Mayer, T. L. Alford: Failure mechanisms of pure silver, pure aluminum and silver-aluminum alloy under high current stress. Microelectronics Reliability 46(12): 2096-2103 (2006) | 
| 2005 | ||
| 1 | EE | E. Misra, Md M. Islam, Mahbub Hasan, H. C. Kim, T. L. Alford: Percolative approach for failure time prediction of thin film interconnects under high current stress. Microelectronics Reliability 45(2): 391-395 (2005) | 
| 1 | Mahbub Hasan | [1] | 
| 2 | Md M. Islam | [1] | 
| 3 | H. C. Kim | [1] | 
| 4 | J. W. Mayer | [2] | 
| 5 | E. Misra | [1] [2] | 
| 6 | N. D. Theodore | [2] |