| 2008 |
|---|
| 9 | EE | Slawomir Mikula,
Gilbert De Mey,
Andrzej Kos:
Asynchronous control of modules activity in integrated systems for reducing peak temperatures.
Integration 41(3): 447-458 (2008) |
| 2007 |
|---|
| 8 | EE | Marcin Janicki,
Gilbert De Mey,
Andrzej Napieralski:
Thermal analysis of layered electronic circuits with Green's functions.
Microelectronics Journal 38(2): 177-184 (2007) |
| 7 | EE | B. Vermeersch,
Gilbert De Mey:
Influence of substrate thickness on thermal impedance of microelectronic structures.
Microelectronics Reliability 47(2-3): 437-443 (2007) |
| 2006 |
|---|
| 6 | EE | Jaroslaw Legierski,
Boguslaw Wiecek,
Gilbert De Mey:
Measurements and simulations of transient characteristics of heat pipes.
Microelectronics Reliability 46(1): 109-115 (2006) |
| 5 | EE | B. Vermeersch,
Gilbert De Mey:
Thermal impedance plots of micro-scaled devices.
Microelectronics Reliability 46(1): 174-177 (2006) |
| 2004 |
|---|
| 4 | EE | Octavio A. Leon,
Gilbert De Mey,
Erik Dick,
Jan A. Vierendeels:
Staggered heat sinks with aerodynamic cooling fins.
Microelectronics Reliability 44(7): 1181-1187 (2004) |
| 2002 |
|---|
| 3 | EE | Gilbert De Mey:
A thermodynamic limit for digital electronics.
Microelectronics Reliability 42(4-5): 507-510 (2002) |
| 2 | EE | Marcin Janicki,
Gilbert De Mey,
Andrzej Napieralski:
Transient thermal analysis of multilayered structures using Green's functions.
Microelectronics Reliability 42(7): 1059-1064 (2002) |
| 1 | EE | Octavio A. Leon,
Gilbert De Mey,
Erik Dick:
Study of the optimal layout of cooling fins in forced convection cooling.
Microelectronics Reliability 42(7): 1101-1111 (2002) |
