| |
| 2006 | ||
|---|---|---|
| 1 | EE | Changsoo Jang, Seongyoung Han, Hangyu Kim, Sayoon Kang: A numerical failure analysis on lead breakage issues of ultra fine pitch flip chip-on-flex and tape carrier packages during chip/film assembly process. Microelectronics Reliability 46(2-4): 487-495 (2006) |
| 1 | Seongyoung Han | [1] |
| 2 | Changsoo Jang | [1] |
| 3 | Hangyu Kim | [1] |