| |
| 2006 | ||
|---|---|---|
| 1 | EE | T. Kangasvieri, O. Nousiainen, J. Putaala, R. Rautioaho, J. Vähäkangas: Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies. Microelectronics Reliability 46(8): 1335-1347 (2006) |
| 1 | T. Kangasvieri | [1] |
| 2 | O. Nousiainen | [1] |
| 3 | J. Putaala | [1] |
| 4 | J. Vähäkangas | [1] |