Ryerson University, Toronto, Canada
List of publications from the DBLP Bibliography Server - FAQother persons with the same name:
2006 | ||
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2 | EE | Hua Lu, Helen Shi, Ming Zhou: Thermally induced deformation of solder joints in real packages: Measurement and analysis. Microelectronics Reliability 46(7): 1148-1159 (2006) |
2005 | ||
1 | EE | Hua Lu, Jesse Zhou, Rich Golek, Ming Zhou: Hybrid reliability assessment for packaging prototyping. Microelectronics Reliability 45(3-4): 597-609 (2005) |
1 | Rich Golek | [1] |
2 | Helen Shi | [2] |
3 | Jesse Zhou | [1] |
4 | Ming Zhou | [1] [2] |