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Hua Lu

Ryerson University, Toronto, Canada

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2006
2EEHua Lu, Helen Shi, Ming Zhou: Thermally induced deformation of solder joints in real packages: Measurement and analysis. Microelectronics Reliability 46(7): 1148-1159 (2006)
2005
1EEHua Lu, Jesse Zhou, Rich Golek, Ming Zhou: Hybrid reliability assessment for packaging prototyping. Microelectronics Reliability 45(3-4): 597-609 (2005)

Coauthor Index

1Rich Golek [1]
2Helen Shi [2]
3Jesse Zhou [1]
4Ming Zhou [1] [2]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)