| 2006 |
|---|
| 5 | EE | Y. Y. Wang,
Tian Huang,
X. M. Zhao,
J. P. Mei,
Derek G. Chetwynd,
S. J. Hu:
Finite Element Analysis and Comparison of Two Hybrid Robotsthe Tricept and the TriVariant.
IROS 2006: 490-495 |
| 4 | EE | Z. W. He,
X. Q. Liu,
D. Y. Xu,
Y. Y. Wang:
Effect of annealing on the properties of low-k nanoporous SiO2 films prepared by sol-gel method with catalyst HF.
Microelectronics Reliability 46(12): 2062-2066 (2006) |
| 2004 |
|---|
| 3 | EE | F. Wang,
Y. Y. Wang,
C. Lu:
Failure probability of wire bonding packages.
International Journal of Computational Engineering Science 5(2): 379-386 (2004) |
| 2001 |
|---|
| 2 | | Bin Fang,
Y. Y. Wang,
C. H. Leung,
K. W. Tse,
Yuan Yan Tang,
Paul C. K. Kwok,
Y. K. Wong:
Offline Signature Verification by the Analysis of Cursive Strokes.
IJPRAI 15(4): 659-673 (2001) |
| 1999 |
|---|
| 1 | EE | Bin Fang,
Y. Y. Wang,
C. H. Leung,
Yuan Yan Tang,
Paul C. K. Kwok,
K. W. Tse,
Y. K. Wong:
A Smoothness Index based Approach for Off-line Signature Verification.
ICDAR 1999: 785-787 |
