| |
| 2008 | ||
|---|---|---|
| 3 | EE | Arrul Azlan Hamzah, Yusnira Husaini, Burhanuddin Yeop Majlis, Ibrahim Ahmad: Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging CoRR abs/0802.3086: (2008) |
| 2006 | ||
| 2 | EE | Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition. Microelectronics Reliability 46(2-4): 367-379 (2006) |
| 1 | EE | Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: Effect of wafer thinning methods towards fracture strength and topography of silicon die. Microelectronics Reliability 46(5-6): 836-845 (2006) |
| 1 | Mohd Khairuddin Md Arshad | [2] |
| 2 | Arrul Azlan Hamzah | [3] |
| 3 | Yusnira Husaini | [3] |
| 4 | Azman Jalar | [1] [2] |
| 5 | Hoh Huey Jiun | [1] |
| 6 | Burhanuddin Yeop Majlis | [3] |
| 7 | Ghazali Omar | [1] [2] |