| |
| 2006 | ||
|---|---|---|
| 2 | EE | T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf Aschenbrenner, Herbert Reichl: High-temperature reliability of Flip Chip assemblies. Microelectronics Reliability 46(1): 144-154 (2006) |
| 2005 | ||
| 1 | EE | T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf Aschenbrenner, Herbert Reichl: Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications. Microelectronics Reliability 45(9-11): 1672-1675 (2005) |
| 1 | Rolf Aschenbrenner | [1] [2] |
| 2 | V. Bader | [1] [2] |
| 3 | T. Braun | [1] [2] |
| 4 | M. Koch | [1] [2] |
| 5 | Herbert Reichl | [1] [2] |