| |
| 2007 | ||
|---|---|---|
| 2 | EE | Soon-Bok Lee, Jin-Woo Kim, Chee-Yang Song, Doo-Kwon Baik: An Approach to Analyzing Commonality and Variability of Features using Ontology in a Software Product Line Engineering. SERA 2007: 727-734 |
| 2006 | ||
| 1 | EE | Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik: Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. Microelectronics Reliability 46(2-4): 512-522 (2006) |
| 1 | Doo-Kwon Baik | [2] |
| 2 | Young-Doo Jeon | [1] |
| 3 | Jin-Woo Kim | [2] |
| 4 | Kyung-Wook Paik | [1] |
| 5 | Chee-Yang Song | [2] |
| 6 | Se Young Yang | [1] |