Helen Shi
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2006
1
EE
Hua Lu
, Helen Shi,
Ming Zhou
: Thermally induced deformation of solder joints in real packages: Measurement and analysis.
Microelectronics Reliability 46
(7): 1148-1159 (2006)
Coauthor
Index
1
Hua Lu
[
1
]
2
Ming Zhou
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
