| |
| 2006 | ||
|---|---|---|
| 2 | EE | M. Y. Pan, M. Gupta, A. A. O. Tay, K. Vaidyanathan: Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging. Microelectronics Reliability 46(5-6): 763-767 (2006) |
| 2002 | ||
| 1 | EE | O. Gay-Bellile, X. Marchal, G. Burns, K. Vaidyanathan: A reconfigurable superimposed 2D-mesh array for channel equalization. ISCAS (1) 2002: 893-896 |
| 1 | G. Burns | [1] |
| 2 | O. Gay-Bellile | [1] |
| 3 | M. Gupta | [2] |
| 4 | X. Marchal | [1] |
| 5 | M. Y. Pan | [2] |
| 6 | A. A. O. Tay | [2] |