| 2006 |
|---|
| 7 | EE | M. Bigas,
Enric Cabruja:
Characterisation of electroplated Sn/Ag solder bumps.
Microelectronics Journal 37(4): 308-316 (2006) |
| 6 | EE | M. Bigas,
Enric Cabruja,
Josep Forest,
Joaquim Salvi:
Review of CMOS image sensors.
Microelectronics Journal 37(5): 433-451 (2006) |
| 5 | EE | M. Ullán,
M. Lozano,
M. Chmeissani,
G. Blanchot,
Enric Cabruja,
J. García,
M. Maiorino,
R. Martínez,
G. Pellegrini,
C. Puigdengoles:
Test structure assembly for bump bond yield measurement on high density flip chip technologies.
Microelectronics Reliability 46(7): 1095-1100 (2006) |
| 2004 |
|---|
| 4 | EE | Josep Forest,
Joaquim Salvi,
Enric Cabruja,
Carles Pous:
Laser Stripe Peak Detector for 3D Scanners. A FIR Filter Approach.
ICPR (3) 2004: 646-649 |
| 2001 |
|---|
| 3 | EE | José Luis Merino,
Sebastià A. Bota,
A. Herms,
Josep Samitier,
Enric Cabruja,
X. Jordà,
M. Vellvehí,
J. Bausells,
A. Ferré,
J. Bigorr:
Smart Temperature Sensor for On-Line Monitoring in Automotive Applications.
IOLTW 2001: 122-126 |
| 2 | EE | J. Barton,
G. McCarthy,
R. Doyle,
K. Delaney,
Enric Cabruja,
M. Lozano,
A. Collado,
J. Santander:
Reliability evaluation of a silicon-on-silicon MCM-D package.
Microelectronics Reliability 41(6): 887-899 (2001) |
| 1995 |
|---|
| 1 | | Elena Valderrama,
Rosa Villa,
Enric Cabruja,
Paco Garrido,
Xavier Navarro,
Miquel Buti,
Santiago Calvet:
Regenerative-Type Neural Interface.
IWANN 1995: 114-120 |
