| |
| 2006 | ||
|---|---|---|
| 2 | EE | M. Ullán, M. Lozano, M. Chmeissani, G. Blanchot, Enric Cabruja, J. García, M. Maiorino, R. Martínez, G. Pellegrini, C. Puigdengoles: Test structure assembly for bump bond yield measurement on high density flip chip technologies. Microelectronics Reliability 46(7): 1095-1100 (2006) |
| 1984 | ||
| 1 | R. Dogliotti, G. Pellegrini: Economics of Fibre Systems in Local Distribution Networks. ICC (2) 1984: 894-897 | |
| 1 | G. Blanchot | [2] |
| 2 | Enric Cabruja | [2] |
| 3 | M. Chmeissani | [2] |
| 4 | R. Dogliotti | [1] |
| 5 | J. García | [2] |
| 6 | M. Lozano | [2] |
| 7 | M. Maiorino | [2] |
| 8 | R. Martínez | [2] |
| 9 | C. Puigdengoles | [2] |
| 10 | M. Ullán | [2] |