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2006 | ||
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2 | EE | Ching-Yang Chen, Yung-Ching Chao, De-Shin Liu, Zhen-Wei Zhuang: Design of a novel chip on glass package solution for CMOS image sensor device. Microelectronics Reliability 46(8): 1326-1334 (2006) |
2002 | ||
1 | EE | Chin-Yu Ni, De-Shin Liu, Ching-Yang Chen: Procedure for design optimization of a T-cap flip chip package. Microelectronics Reliability 42(12): 1903-1911 (2002) |
1 | Yung-Ching Chao | [2] |
2 | De-Shin Liu | [1] [2] |
3 | Chin-Yu Ni | [1] |
4 | Zhen-Wei Zhuang | [2] |