L. Gignac
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2006
1
EE
Chao-Kun Hu
, L. Gignac,
R. Rosenberg
: Electromigration of Cu/low dielectric constant interconnects.
Microelectronics Reliability 46
(2-4): 213-231 (2006)
Coauthor
Index
1
Chao-Kun Hu
[
1
]
2
R. Rosenberg
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
