M. Y. Tsai
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2006
1
EE
M. Y. Tsai,
W. C. Chiang
,
T. M. Liu
,
G. H. Hsu
: Thermal deformation measurements and predictions of MAP-BGA electronic packages.
Microelectronics Reliability 46
(2-4): 476-486 (2006)
Coauthor
Index
1
W. C. Chiang
[
1
]
2
G. H. Hsu
[
1
]
3
T. M. Liu
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
