| 2006 |
|---|
| 3 | EE | C. K. Wong,
H. Wong,
M. Chan,
C. W. Kok,
H. P. Chan:
Minimizing hydrogen content in silicon oxynitride by thermal oxidation of silicon-rich silicon nitride.
Microelectronics Reliability 46(12): 2056-2061 (2006) |
| 2004 |
|---|
| 2 | EE | M. A. Uddin,
M. O. Alam,
Y. C. Chan,
H. P. Chan:
Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film.
Microelectronics Reliability 44(3): 505-514 (2004) |
| 1 | EE | C. W. Tan,
Y. C. Chan,
H. P. Chan,
N. W. Leung,
C. K. So:
Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging.
Microelectronics Reliability 44(5): 823-831 (2004) |
