| |
| 2006 | ||
|---|---|---|
| 1 | EE | Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik: Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. Microelectronics Reliability 46(2-4): 512-522 (2006) |
| 1 | Young-Doo Jeon | [1] |
| 2 | Soon-Bok Lee | [1] |
| 3 | Kyung-Wook Paik | [1] |