2007 |
3 | EE | Daniel J. Poindexter,
Scott R. Stiffler,
Philip T. Wu,
Paul D. Agnello,
Thomas Ivers,
Shreesh Narasimha,
Thomas B. Faure,
Jed H. Rankin,
David A. Grosch,
Marc D. Knox,
Daniel C. Edelstein,
Mukesh Khare,
Gary B. Bronner,
Hyun-Jang Nam,
Shahid A. Butt:
Optimization of silicon technology for the IBM System z9.
IBM Journal of Research and Development 51(1/2): 5-18 (2007) |
2006 |
2 | EE | F. Chen,
J. Gill,
D. Harmon,
T. Sullivan,
A. Strong,
B. Li,
H. Rathore,
Daniel C. Edelstein:
Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures.
Microelectronics Reliability 46(2-4): 232-243 (2006) |
1995 |
1 | | Daniel C. Edelstein,
George A. Sai-Halasz,
Yuh-Jier Mii:
VLSI on-chip interconnection performance simulations and measurements.
IBM Journal of Research and Development 39(4): 383-402 (1995) |