| |
| 2006 | ||
|---|---|---|
| 1 | EE | Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo, Masayuki Kaneto: Experimental study on the thermo-mechanical effects of underfill and low-CTE substrate in a flip-chip device. Microelectronics Reliability 46(5-6): 923-929 (2006) |
| 1 | Kazuo Arakawa | [1] |
| 2 | Yasuyuki Morita | [1] |
| 3 | Mitsugu Todo | [1] |