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2006 | ||
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1 | EE | A. S. Fleischer, U. Troppenz, M. Hamacher, W. John: Thermal analysis of bond layer influence on performance of an all-active vertically coupled, microring resonating laser. Microelectronics Reliability 46(2-4): 421-431 (2006) |
1 | A. S. Fleischer | [1] |
2 | W. John | [1] |
3 | U. Troppenz | [1] |