C. Q. Wang
List of publications from the
DBLP Bibliography Server
-
FAQ
Coauthor Index
- Ask others: ACM
DL
/
Guide
-
CiteSeer
-
CSB
-
Google
-
MSN
-
Yahoo
2006
1
EE
H. T. Chen
, C. Q. Wang,
M. Y. Li
: Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling.
Microelectronics Reliability 46
(8): 1348-1356 (2006)
Coauthor
Index
1
H. T. Chen
[
1
]
2
M. Y. Li
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
