| 2006 |
|---|
| 3 | EE | Alberto Castellazzi,
Mauro Ciappa,
Wolfgang Fichtner,
G. Lourdel,
Michel Mermet-Guyennet:
Compact modelling and analysis of power-sharing unbalances in IGBT-modules used in traction applications.
Microelectronics Reliability 46(9-11): 1754-1759 (2006) |
| 2 | EE | D. Barlini,
Mauro Ciappa,
Alberto Castellazzi,
Michel Mermet-Guyennet,
Wolfgang Fichtner:
New technique for the measurement of the static and of the transient junction temperature in IGBT devices under operating conditions.
Microelectronics Reliability 46(9-11): 1772-1777 (2006) |
| 1 | EE | X. Perpiñà,
J. F. Serviere,
J. Saiz,
D. Barlini,
Michel Mermet-Guyennet,
J. Millán:
Temperature measurement on series resistance and devices in power packs based on on-state voltage drop monitoring at high current.
Microelectronics Reliability 46(9-11): 1834-1839 (2006) |
