| |
| 2006 | ||
|---|---|---|
| 2 | EE | Michael C. Larson, Melody A. Verges, Xia Liu: Residual compression in area array packages induced by underfill shrinkage. Microelectronics Reliability 46(2-4): 496-502 (2006) |
| 1 | EE | Xia Liu, Valmiki K. Sooklal, Melody A. Verges, Michael C. Larson: Experimental study and life prediction on high cycle vibration fatigue in BGA packages. Microelectronics Reliability 46(7): 1128-1138 (2006) |
| 1 | Xia Liu | [1] [2] |
| 2 | Valmiki K. Sooklal | [1] |
| 3 | Melody A. Verges | [1] [2] |