| |
| 2006 | ||
|---|---|---|
| 1 | EE | Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi: Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. Microelectronics Reliability 46(2-4): 432-439 (2006) |
| 1 | Periannan Arulvanan | [1] |
| 2 | Zhaowei Zhong | [1] |