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Xunqing Shi

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2006
1EEPeriannan Arulvanan, Zhaowei Zhong, Xunqing Shi: Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. Microelectronics Reliability 46(2-4): 432-439 (2006)

Coauthor Index

1Periannan Arulvanan [1]
2Zhaowei Zhong [1]

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