| |
| 2007 | ||
|---|---|---|
| 3 | EE | Z. Khatir, S. Lefebvre, F. Saint-Eve: Experimental and numerical investigations on delayed short-circuit failure mode of single chip IGBT devices. Microelectronics Reliability 47(2-3): 422-428 (2007) |
| 2006 | ||
| 2 | EE | L. Dupont, Z. Khatir, S. Lefebvre, S. Bontemps: Effects of metallization thickness of ceramic substrates on the reliability of power assemblies under high temperature cycling. Microelectronics Reliability 46(9-11): 1766-1771 (2006) |
| 2004 | ||
| 1 | EE | Z. Khatir, S. Lefebvre: Boundary element analysis of thermal fatigue effects on high power IGBT modules. Microelectronics Reliability 44(6): 929-938 (2004) |
| 1 | S. Bontemps | [2] |
| 2 | L. Dupont | [2] |
| 3 | Z. Khatir | [1] [2] [3] |
| 4 | F. Saint-Eve | [3] |