W. Dreyer
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2006
1
EE
W. Dreyer,
F. Duderstadt
,
S. Eichler
,
M. Jurisch
: Stress analysis and bending tests for GaAs wafers.
Microelectronics Reliability 46
(5-6): 822-835 (2006)
Coauthor
Index
1
F. Duderstadt
[
1
]
2
S. Eichler
[
1
]
3
M. Jurisch
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
