| |
| 2006 | ||
|---|---|---|
| 2 | EE | Chao-Kun Hu, L. Gignac, R. Rosenberg: Electromigration of Cu/low dielectric constant interconnects. Microelectronics Reliability 46(2-4): 213-231 (2006) |
| 1995 | ||
| 1 | Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin: Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. IBM Journal of Research and Development 39(4): 465-498 (1995) | |
| 1 | Dennis P. Bouldin | [1] |
| 2 | L. Gignac | [2] |
| 3 | Kim Y. Lee | [1] |
| 4 | Kenneth P. Rodbell | [1] |
| 5 | R. Rosenberg | [2] |
| 6 | Timothy D. Sullivan | [1] |