| |
| 2006 | ||
|---|---|---|
| 2 | EE | Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang: Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectronics Reliability 46(2-4): 523-534 (2006) |
| 2004 | ||
| 1 | EE | Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang: Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application. Microelectronics Reliability 44(4): 627-638 (2004) |
| 1 | Kenny Chang | [2] |
| 2 | Kuo-Ning Chiang | [1] [2] |
| 3 | Terry Ku | [2] |
| 4 | Chih-Tang Peng | [2] |
| 5 | Ming-Chuen Yip | [1] |