Li-hsin Chang
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2006
1
EE
Amy S. Fleischer
, Li-hsin Chang,
Barry C. Johnson
: The effect of die attach voiding on the thermal resistance of chip level packages.
Microelectronics Reliability 46
(5-6): 794-804 (2006)
Coauthor
Index
1
Amy S. Fleischer
[
1
]
2
Barry C. Johnson
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
